• Method for creating 3D integrated circuit connections at low temperatures that does not require external pressures

    11 days ago - By Phys.org

    Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, which can reduce the cost and energy requirements of new electronic devices. This work may help in the design of next-generation smart devices that are more compact and use less electricity.
    Read more ...

     

  • High performance integrated photonic circuit based on inverse design method

    11 days ago - By Phys.org

    A new publication from Opto-Electronic Advances discusses high performance integrated photonic-circuit-based on inverse design method.
    Read more ...